Description
Cost-effective thermal management solution for high-power laser diodes and RF amplifiers. Features industry-standard Ti/Pt/Au metallization for solder attachment.
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Additional information
| Dimensions |
$10.0 \times 10.0 \times 0.3\text{ mm}$ |
|---|---|
| Surface Finish |
As-Grown |
| Orientation |
{110} |
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